610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Providing Solutions to the Semiconductor & Optoelectronic Industries

Majelac Technologies Offers:

  • Wafer Dicing, IC Assembly, COB Assembly, and Flip Chip Assembly Services
  • Ball Bonding, Wedge Bonding, Stud Bumping, and Heavy Wire Bonding
  • Epoxy Die Attach, Solder Die Attach, and Eutectic Die Attach
  • Ultra Fine Pitch Wire Bonding down to 35 microns
  • Die Bonding, Wire Bonding, Transfer Molding, and Ink Marking.
  • Quick Turnaround Assembly Service, including Same Day Assembly Service.

Contact us today to learn more about our capabilities.

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Our Standard Process

Majelac Technologies specializes in quick turnaround assembly service.

Our standard service, which includes wafer dicing through ink marking, can be completed in only 8 hours.

Our clients can ship a wafer or diced dies to us and we can ship completed devices back out the same day.

Open Cavity QFN, QFP, SOIC, and various Ceramic packages are available for immediate assembly

Please view our video to see the following services in action:

  • Wafer Dicing
  • Die Sorting
  • Die Bonding
  • Gold Ball Bonding

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Majelac Technologies Specializes in: