Superior Service for your Most Challenging IC Packaging needs !
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Superior Service for your Most Challenging IC Packaging needs !
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Majelac Technologies provides subcontract assembly services to the Semiconductor & Optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of a large variety of package types. Our services include:
Our package capabilities include:
Wafer Dicing, Die Bonding, Wire Bonding, Sorting, and Encapsulation are performed in a class 10000 clean room. We also utilize a class 1000 clean room and clean hoods for more critical applications. Majelac understands that time to market is critical to its customers. We have invested in highly automated flexible equipment. This investment allows us to produce your IC package in the shortest possible cycle time. We use CAD import to setup our wire bonders. Using this technique we can teach a new prototype device in the time it takes to cure the die attach epoxy. Speed is useless without Quality and our process has been developed to produce repeatable results. We offer fine-pitch wire bonding down to 50 microns with three rows of bond pads. We also can assemble Flip Chip devices. Contact us today to learn more about our capabilities.
Contact Information:Telephone: 610-459-8786 Fax: 610-459-2870 Postal address: 262 Bodley Road, Aston, PA 19014 email:
Sales & Customer Support:
info@majelac.com
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webmaster@majelac.com with
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