Contact us today to learn more about our capabilities.
Majelac Technologies specializes in quick turnaround assembly service.
Our standard service, which includes wafer dicing through ink marking, can be completed in only 8 hours.
Our clients can ship a wafer or diced dies to us and we can ship completed devices back out the same day.
Open Cavity QFN, QFP, SOIC, and various Ceramic packages are available for immediate assembly
Please view our video to see the following services in action: