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Majelac Technologies specializes in Quick Turn Packaging.
Cycle times of 4, 8, & 24 hours are available !
 Download our brochure click here >> Majelac_brochure.pdf
Our current capabilities include:
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Wafer sawing /
dicing (up
to 200 mm wafer diameter) |
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Eutectic Die Bonding
(AuSi or AuSn) |
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Epoxy Die Bonding |
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Gold Ball
Bonding (50 micron pitch capability) |
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Aluminum
Wedge Bonding (0.7 mil to 2.0 mil wire) |
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Gold Wedge Bonding
(0.7 mil to 2.0 mil wire ) |
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Gold Ribbon
Bonding |
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Wire Pull
Testing |
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Ball Shear
Testing |
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Epoxy
Encapsulation |
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Molding of
LQFP (10mm, 14mm, 20mm, 24mm body size) |
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Molding of PBGA
(15mm, 23mm, 27mm & 35mm body size) |
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Ink Marking |
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Solder Ball Attach |
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SMT Component
Removal |
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Singulation
(Sawing or Router) |
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Reflow (up to
400C) |
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Screen Printing |
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SMT assembly (Auto
Pick & Place) |
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Header Attachment |
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BGA Reballing |
Our packaging
capabilities include:
BGA
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PBGA - Plastic
Ball Grid Array (Body sizes from 15mm to 35mm) |
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FBGA - Fine
Pitch BGA (Body sizes from 7 to15mm) |
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EBGA - Thermally
Enhanced BGA (Body sizes from 23 mm to 45mm) |
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LBGA -
Laminated BGA (Body sizes from 23mm to 45mm) |
CERAMIC
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Side
Braze Ceramic DIP (6 lead to 48 lead) |
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Cerquad (all
lead counts) |
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Leadless Chip
Carrier |
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J-Lead Chip
Carrier |
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Flat Pack
(Bottom or Top Braze) |
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PGA - Pin Grid
Array (Cavity Up or Cavity Down) |
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SOIC |
PLASTIC
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Open Cavity
Plastic Packages (QFN, SOIC, LQFP) |
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Molded QFN
(24,32,48 lead) |
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Molded LQFP's
(coming 1st qtr 2007) |
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