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Superior Service for your Most Challenging IC Packaging needs !
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Majelac Technologies can build your Multi Component Packages and Surface Mount Boards. Majelac can assemble your SMT board and combine Chip on Board, (COB), assembly. Gold Ball Bonding or Wedge Bonding are available for your COB modules.
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webmaster@majelac.com with
questions or comments about this web site.
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