610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

About

Majelac Technologies is a privately owned company focused on providing assembly technology to the semiconductor industry.
2002
Founded in 2002, Majelac Technolgies LLC began with a simple goal in mind: to offer a higher caliber of quick-turn IC assembly services to the semiconductor industry. Founder and President Michael Quinn, armed with 20 years of industry experience, first opened Majelac’s doors in the  Allentown Economic Development Corporations, BridgeWorks Facility as part of The Ben Franklin Partnership for Start-Up Companies.
Majelac began offering wafer dicing, die attach, and gold wire bonding as just a few of our services.

2004

In 2004 we worked with a start-up company developing BGA packages for use in an implantable defibrillator. We assembled the initial designs and after passing qualification we built early production quantities for non-human trials.

2005
Quickly carving out a space in the industry, in 2005, Majelac Technologies expands to a second suite inside the Bridgeworks facility, making additional space for expanded services including Flip Chip Assembly and Overmolding.
2006

In 2006, having proven our capabilities in prototype design and development, Majelac is approached and ultimately partners with a start-up company to develop a MEMS microphone. We were contracted with the development of initial initial prototypes and all early production units.  With the successful qualification and initial assembly of the first 300,000 field grade units, Majelac continues its path towards growth and industry excellence.


2007

In 2007, Majelac Technologies expands again and makes our interim relocation to Aston, Pennsylvania. This move continued our ultimate drive towards continued expansion and the development of a new manufacturing facility customized to our founder’s unique specifications to further improve our quality of services.
2009
In 2009, driven by the foundry industry, Majelac invests in 300 mm dicing equipment specifically targeted at providing dicing services for MPW, (Multi Project Wafers) on 300 mm silicon. This same year we worked with a startup company to develop a solar panel product using microelectronic packaging techniques.
2012
With construction completed on the new facility, Majelac completes its relocation to the Philadelphia region in 2012. The new Facility located in Garnet Valley, Pennsylvania is custom fit for semiconductor assembly services including ESD flooring, and Clean Rooms.
2014
In 2014, Majelac expands its suite of services to include Heavy Wirebond and Vacuum Solder Reflow.
2015
In 2015, with the purchase of a high end CNC milling machine, Majelac Technologies successfully develops tooling that allows us to offer products including molded packages.
2017
Now, in 2017, Majelac Technologies LLC celebrates 15 years and looks eagerly to the future, striving for excellence and continuing a strong tradition of exemplary IC assembly servies.