Majelac Technologies offers wire bonded PBGA assembly service and Flip Chip, FCBGA assembly service. We offer fully automated assembly including wafer dicing, die attach, wirebonding, overmolding, marking, BGA sphere attach, and singulation.
Our Die bonders feature automated die centering to compensate for substrate tolerances. Our wirebonders are equipped with Cognex vision systems which scan each bond finger to ensure accurately placed wires. Our Boschman Mold Presses are configured for Transfer Molding of FBGA and PBGA substrates. We also offer Dam & Fill encapsulation. Singulation is completed via dicing saw or automatic circuit board router.
We stock PBGA substrates ranging from 49 balls to 700 balls.