610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

BGA Reballing

bga reballingMajelac Technologies BGA reballing service has been designed to safely repair your valuable devices. Whether it's a single BGA for repair or thousands of BGA's for conversion from lead free to leaded solder balls, Majelac has the tools and skills to meet your needs. 

We specialize in RoHS (leadfree) to Eutectic (63Sn/37Pb) conversion.

Since the European Union's directive for the Restriction of Hazardous Substances, RoHS,  almost all packaging is now lead free. This can sometimes be a reliability issue for Ball Grid Array products. Majelac Technologies has many years of experience converting lead free BGA's back to Eutectic Solder. We have completed this service on over 250,000 units over the last 5 years.

IN STOCK SOLDER BALLS

RoHS (SAC 305) or Leaded (63Sn/37Pb)

Available Diameters

  • 0.20 mm
  • 0.25 mm
  • 0.30 mm
  • 0.35 mm
  • 0.40 mm
  • 0.45 mm
  • 0.50 mm
  • 0.55 mm
  • 0.60 mm
  • 0.65 mm
  • 0.76 mm