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610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

BGA Reballing

majelac photo 7Majelac Technologies BGA reballing-service has been designed to safely repair your valuable devices. Whether it's a single BGA for repair or thousands of BGA's for conversion from lead-free to leaded solder balls, Majelac has the tools and skills to meet your needs.

 

We specialize in RoHS (lead-free) to Eutectic (63Sn/37Pb) conversion.

Since the European Union's directive for the Restriction of Hazardous Substances, RoHS,  almost all packaging is now lead-free. This can sometimes be a reliability issue for Ball Grid Array products. Majelac Technologies has many years of experience converting lead-free BGA's back to Eutectic Solder. We have completed this service on over 250,000 units over the last 5 years.

IN STOCK SOLDER BALLS

RoHS (SAC 305) or Leaded (63Sn/37Pb)

Available Diameters

  • 0.20 mm
  • 0.25 mm
  • 0.30 mm
  • 0.35 mm
  • 0.40 mm
  • 0.45 mm
  • 0.50 mm
  • 0.55 mm
  • 0.60 mm
  • 0.65 mm
  • 0.76 mm