Majelac offers epoxy encapsulation after wire bonding to protect the bond wires. We can do a Glob Top, Dam & Fill, or partial encapsulation.
Transfer molding is available for BGA and QFN packages. If you have a custom device we can design a mold to fit your product.
Lid attach is the most common method we see for cavity style packages. We can attach lids with epoxy or tape. We also offer Au/Sn hermetic lid attach.
Ink Marking is available via our pad printer. We can make laser engraved plates in house with your device ID, Date Code, and Logo.
- In addition to ink marking, Majelac now has the technology that can accurately accomplish the task at hand at an even faster rate than our previous methods through laser marking.
- We now have the ability to provide high quality marking on a variety of products. Improving the condition of the merchandise, and the speed that we are able to produce such products.
- Our range of solutions allows us to meet the manufacturing standards of our customers in an efficient and effective way.
How does laser marking work?
- In the semiconductor industry, laser marking is a highly efficient method that prides itself on the accuracy, speed, and durability of the permanent marks on any given wafer.