Majelac offers epoxy encapsulation after wire bonding to protect the bond wires. We can do a Glob Top, Dam & Fill, or partial encapsulation.
Transfer molding is available for BGA and QFN packages. If you have a custom device we can design a mold to fit your product.
Lid attach is the most common method we see for cavity style packages. We can can attach lids with epoxy or tape. We also offer Au/Sn hermetic lid attach.
Ink Marking is available via our pad printer. We can make laser engraved plates in house with your device ID, Date Code, and Logo.