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610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Wire Bonding

BGA wirebonding2

Fine Pitch BGA Wire Bonding

Majelac Technologies offers a variety of wire bonding technologies.

Our wire bonding capabilities include:


Majelac Technologies possesses a suite of bonding equipment which each offer unique capabilities. Our broad array of machines provide the flexibility our clients need for a wide variety of bonding applications. The table below outlines the unique advantages associated with our wire bonding equipment.

Our Wire Bond machines include:

Manufacturer Model Technology Advantage
Kulicke & Soffa IConn Plus Ball / Wedge Ultra Fine Pitch.
Kulicke & Soffa 8098 Ball / Wedge Extra Large work area
Kulicke & Soffa 8060 Wedge / Wedge Aluminum or Gold, 60 um pitch
ESEC 3100 PLUS Ball / Wedge Ultra Fine Pitch, High Speed
ESEC 3088 ip Ball / Wedge Fine Pitch, High Flexibility
Palomar 8000 Ball / Wedge Deep Access / Large Work Area
Westbond 4546E Wedge / Wedge Wire or ribbon, semi-auto
Orthodyne 360B Heavy Wire Quick Setup, Highly Flexible