610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Stud Bumping

Majelac Technologies Stud Bumping Service is available inĀ Gold wire.

Our Wire diameters range from 0.7 to 2.0 mils, (18 microns to 50 microns).

Common applications are gold stud bumping prior to flip chip attach. Typical Flip Chip attach process with gold stud bumps are thermosonic Flip Chip or thermocompressionĀ  Flip Chip. Other options are epoxy attach.