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610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Stud Bumping

Majelac Technologies Stud Bumping Service is available in Gold wire.

Our Wire diameters range from 0.7 to 2.0 mils, (18 microns to 50 microns).

Common applications are gold stud bumping before flip-chip attach. Typical Flip Chip attach process with gold stud bumps are Thermosonic Flip Chip or Thermocompression  Flip Chip. Other options are epoxy attach.