610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Wedge Bonding

Aluminum Wedge BondingMajelac Technologies Wedge Bonding serviceĀ is available in Gold or Aluminum wire.

Our Wire diameters range from 1.0 to 2.0 mils, (18 microns to 50 microns).

Aluminum wedge bonding is commonly used for Chip-on-Board, (COB) applications. By utilizing Aluminum wire the Printed Circuit board can have a lower cost plating method. Electroless Nickle with Imersion Gold plating, also known as ENIG plating is common for Chip on Board since the wirebond is made to the nickle layer. Typical applications are COB LED.