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BGA Reballing
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 Why throw out that expensive Ball Grid Array package.

 Majelac Technologies can restore your BGA with NEW solder balls !

 Our process includes:

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 Prebake ( To remove moisture )

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 Solder Removal

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 Apply Flux

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 Attach NEW array of solder balls

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 Reflow in Sikama Ultra Profile 2000 Furnace

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 Automated De-Ionized Water Wash

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 Inspect 

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 Final Bake

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 Pack & Ship

 

 We stock PbSn (eutectic) solder balls in the following sizes:

 

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 0.012" (Typical for 0.5 mm pitch BGA)

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 0.015" (Typical for 0.65 mm pitch BGA)

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 0.020" (Typical for 0.8 mm pitch BGA)

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 0.025" (Typical for 1.0 mm picth BGA)

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 0.030" (Typical for 1.27 mm and higher pitch BGA)

 

 Other Custom sizes and Alloys can be ordered to meet your needs.

 Contact us for a competitive price quote.

 Photo's below show a Flip Chip BGA package before and after BGA Reballing.

 

 

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Copyright © 2007 Majelac Technolgies Inc.
Last modified: January 20, 2008