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Ceramic Assembly
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Capabilities

 

Ceramic Packaging at Majelac ranges from low volume prototypes to high volume production.

We can assemble prototypes in Ceramic packages in as little as 4 hours.

Majelac's Ceramic Package Capabilities are listed in table below:

Package Type Pinouts Available
300 mil wide Sidebraze Dip 8,14,16,18,20,22,24
400 mil wide Sidebraze Dip 32
600 mil wide Sidebraze Dip 24,28,32,40,48
Leadless Chip Carriers 16,18,20,22,24,28,32

36,40,44,48,52,68,84
J Lead Chip Carrier 28,44,48,52,68,84
Ceramic PGA 28,64,84,100,108,120,132

144,180,208,223,256,391
Ceramic SOIC 8,16,20,24,28
Cerquad 44,64,80,100,120,128

144,160,208,240,256,304

 

 

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Copyright © 2007 Majelac Technolgies Inc.
Last modified: January 20, 2008