|
Superior Service for your Most Challenging IC Packaging needs !
|
|
Wafer Dicing Ultron Wafer Mounter SEC Wafer Mounter Ultron UV exposure system Disco DFD641 Dicing Saw K&S 918 Dicing Saw - 2 units K&S 798 Dicing Saw K&S 984-10 Dicing Saw CO2 Bubbler - 2 units H2O Solutions DI Water system Die Sort / Die Attach Alphasem Swissline 9002 automatic die bonder/sorter Laurier DS-6000 die sorter K&S 6491 Hybrid Semi-Auto die attach K&S 642 Eutectic manual die attach K&S 6300 Eutectic automatic die bonder ESEC 2007 BGA die bonder ESC Apollo automatic die bonder Flip Chip attach / Pick & Place ESEC CT2000 automatic placement system ESEC Micron 2 automatic Flip Chip placement system Wire Bonding ESEC 3088 Ball Bonder - 2 units ESEC 3006 F/X Ball Bonder - 2 units K&S 1488 Turbo Ball Bonder K&S 8060 Wedge Bonder K&S 4123 Manual Ball Bonder Westbond 4546 Manual Wedge Bonder Yield Engineering Plasma Cleaner Balzers LFC100 Plasma Cleaner Molding/Encapsulation Asymtek Millenium automatic dispenser - 2 units Camalot 1414 dispenser Towa CCS automatic molding system - 2 units Boschman Packstar 210 molding system - 2 units EFD 1500XL manual dispenser - 4 units Trim/Form & Ball Attach/BGA Singulation Vanguard Vai 5020 ball attach PTI automatic Trim Form Press PTI semi-automatic Trim Form Press - 2 units Cencorp TR1000 Router - 2 units Accel Microcell cleaner - 2 units Sikama Ultra Profile 2000 reflow oven |
|
Send mail to
webmaster@majelac.com with
questions or comments about this web site.
|