610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Gold Electroplating Finish
Gold : 99.9%
Thickness  0.00005" 
Knoop Hardness : Max 90 

Open Cavity QFN

open cavity qfn blueMajelac Technologies offers Open Cavity Packages for quick assembly of your prototype IC's. By utilizing Open Cavity Packages we can provide same day assembly service. Open Cavity packages are available in a variety of package types including QFN, SOIC, and QFP. We can assemble prototypes in open cavity packages in as little as 4 hours. Our Open Cavity Packages meet JEDEC standards for body size and footprint.


QFN OPEN CAVITY PACKAGE OPTIONS

Body Size Pin Count Lead Pitch
3 x 3 mm 8 0.65 mm
3 x 3 mm 10 0.5 mm
3 x 3 mm 12 0.65 mm
3 x 3 mm 12 0.5 mm
3 x 3 mm 16 0.5 mm
4 x 4 mm 12 0.8 mm
4 x 4 mm 16 0.65 mm
4 x 4 mm 20 0.5 mm
4 x 4 mm 24 0.5 mm
4 x 4 mm 28 0.4 mm
5 x 5 mm 16 0.8 mm
5 x 5 mm 20 0.65 mm
5 x 5 mm 24 0.65 mm
5 x 5 mm 28 0.5 mm
5 x 5 mm 32 0.5 mm
5 x 5 mm 40 0.4 mm
6 x 6 mm 24 0.65 mm
6 x 6 mm 28 0.65 mm
6 x 6 mm 36 0.5 mm
6 x 6 mm 40 0.5 mm
6 x 6 mm 48 0.4 mm
7 x 7 mm 28 0.8 mm
7 x 7 mm 32 0.5 mm
7 x 7 mm 32 0.65 mm
7 x 7 mm 44 0.5 mm
7 x 7 mm 48 0.5 mm
7 x 7 mm 60 0.4 mm
8 x 8 mm 28 0.8 mm
8 x 8 mm 32 0.8 mm
8 x 8 mm 52 0.5 mm
8 x 8 mm 56 0.5 mm
9 x 9 mm 44 0.65 mm
9 x 9 mm 64 0.5 mm
10 x 10 mm 72 0.5 mm
10 x 10 mm 88 0.4 mm
12 x 12 mm 80 0.5 mm
12 x 12 mm 100 0.4 mm