Majelac Technologies is still open and fully operational. For more information about our new policy changes during the COVID-19 crisis, click here »

610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly

Gold Electroplating Finish
Gold : 99.9%
Thickness  0.00005" 
Knoop Hardness : Max 90 

Open Cavity QFN

open cavity qfn blueMajelac Technologies offers Open Cavity Packages for quick assembly of your prototype IC's. By utilizing Open Cavity Packages we can provide same-day assembly service. Open Cavity packages are available in a variety of package types including QFN, SOIC, and QFP. We can assemble prototypes in open cavity packages in as little as 4 hours. Our Open Cavity Packages meet JEDEC standards for body size and footprint.


QFN OPEN CAVITY PACKAGE OPTIONS

Body Size Pin Count Lead Pitch
3 x 3 mm 8 0.65 mm
3 x 3 mm 10 0.5 mm
3 x 3 mm 12 0.65 mm
3 x 3 mm 12 0.5 mm
3 x 3 mm 16 0.5 mm
4 x 4 mm 12 0.8 mm
4 x 4 mm 16 0.65 mm
4 x 4 mm 20 0.5 mm
4 x 4 mm 24 0.5 mm
4 x 4 mm 28 0.4 mm
5 x 5 mm 16 0.8 mm
5 x 5 mm 20 0.65 mm
5 x 5 mm 24 0.65 mm
5 x 5 mm 28 0.5 mm
5 x 5 mm 32 0.5 mm
5 x 5 mm 40 0.4 mm
6 x 6 mm 24 0.65 mm
6 x 6 mm 28 0.65 mm
6 x 6 mm 36 0.5 mm
6 x 6 mm 40 0.5 mm
6 x 6 mm 48 0.4 mm
7 x 7 mm 28 0.8 mm
7 x 7 mm 32 0.5 mm
7 x 7 mm 32 0.65 mm
7 x 7 mm 44 0.5 mm
7 x 7 mm 48 0.5 mm
7 x 7 mm 60 0.4 mm
8 x 8 mm 28 0.8 mm
8 x 8 mm 32 0.8 mm
8 x 8 mm 52 0.5 mm
8 x 8 mm 56 0.5 mm
9 x 9 mm 44 0.65 mm
9 x 9 mm 64 0.5 mm
10 x 10 mm 72 0.5 mm
10 x 10 mm 88 0.4 mm
12 x 12 mm 80 0.5 mm
12 x 12 mm 100 0.4 mm