Superior Service for your Most Challenging IC Packaging needs !
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Superior Service for your Most Challenging IC Packaging needs !
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| Majelac Technologies offers dicing services for a variety of applications. For the Semiconductor industry we typically dice silicon wafers, MPW wafers, and even individual dies. We also can provide wafer grooving used in the dice before grind process.
Our state of the art dicing equipment includes automated Disco dicing saws and K&S dicing saws. Water quality is maintained using our De-Ionized water system with CO2 bubbler. Wafers up to 300 mm can be sawed using our automatic dicing equipment. Majelac Can Dice:
Majelac can develop a custom dicing process for your application
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