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610-459-8786 Semiconductor Packaging & Integrated Circuit Assembly


Assembly Process Technician
Majelac Technologies LLC - Garnet Valley, PA
Majelac Technologies has an opening for an Assembly Process Technician for Wafer
Dicing, Die Attach, and Wire Bonding processes. Prior experience is preferred but not mandatory.

Job Responsibilities
• Program, set-up and operate automated wire bonding machine. K&S Iconn, and

wirebond machines.
• Ability to operate machine for full shift after programing is completed
• Able to inspect product using a microscope.
• Hands on experience with precision die placement, flip chip and epoxy dispensing.
• Ability to work with tweezers including threading fine wire
• Capable to review Assembly Travelers and Manufacturing Process Instructions.
• Flexibility to be trained in additional microelectronics assembly equipment such as Wafer Saws, and Die Bonders.
Preferred Qualifications.
• Minimum High School diploma.
• AS Degree in Engineering or related field preferred.
• Experience with K&S Iconn Wirebond machine is preferred.

Skills and Abilities:
• Requires fine motor skills using a microscope for extended periods.
• Experience with automated Die Attach and Wire Bond equipment.
• Excellent computer literacy (MS Office, Word, Excel)
• Excellent verbal and written communication skills.
• Creativity in problem solving, full of energy, willing to learn new skills.

Other Requirements:
• US citizen or permanent resident.
• This is a light manufacturing position that requires extended periods of standing and walking.
Job Type: Full-time
• Dental Insurance
• Health Insurance

• 8 Hour Shift
• Monday to Friday

Benefit Conditions:
• Only full-time employees eligible

Work Remotely:
• No

Job Type: Full-time

COVID-19 considerations:
To Keep our employees safe we have restricted how many people are allowed in the facility. Employees are required to wear face coverings and gloves. Work areas are cleaned daily.